Fully Automatic 24-Station Spin Coater with Customizable Dispense & Spin Speed for High Uniformity and Zero Cross-Contamination

This 24-station spin coater is engineered for automated, high-throughput thin-film deposition. Each of the 24 independent coating positions accommodates substrates up to 200 mm diameter (or 156×156 mm square). The system sequentially executes dispense, acceleration, spin-hold, and edge-bead removal steps through a customizable recipe database.

Key advantages:

• Zero cross-contamination - individual bowls and exhaust for each station
• High uniformity < ±3% at 3000 rpm across all stations
• Full customization - substrate material (Si, glass, polymer, metal), gas purging (N₂, clean dry air), and post-spin rinse steps

All stations are controlled by a central PLC+HMI, supporting SECS/GEM for factory automation integration.

When integrated into a coating line, the 24-station spin coater typically works with:

1. Loader / unloader (magazine-to-magazine or cassette-to-cassette) - customizable interface
2. Pre-alignment station - optional edge/notch alignment
3. 24-station spin coater - main unit
4. Edge bead remover (EBR) - integrated or separate station
5. Post-coating bake plate - hotplate or IR (programmable)
6. Cooling station - active or passive
7. Central chemical dispense system - 1-12 bottles with auto-refill
8. Exhaust & solvent recovery system - customizable for photoresist, PI, PMMA, etc.

• Semiconductor - photoresist coating (i-line, KrF, ArF)
• Perovskite solar cells - large-area uniform deposition
• OLED / QLED - hole injection/transport layers
• MEMS & microfluidics - SU-8, PDMS, polymer coatings
• R &D & pilot line - multi-substrate process development
• Glass / sapphire / ceramic substrates - surface planarization
• Lithium battery - slurry coating on separator or electrode

This 24-station spin coater is highly customizable in the following aspects:

• Substrate size & shape - round, square, rectangle, or custom cutouts
• Chuck design - vacuum, mechanical clamp, or electrostatic chuck
• Bowl material - PP, PVDF, PTFE, or stainless steel (for aggressive solvents)
• Dispense nozzles - up to 3 independent nozzles per station, customizable XY motion
• Process gases - N₂, clean dry air, Ar, or forming gas
• Backside rinse & edge bead removal - programmable
• Recipe library - unlimited storage for 1000+ custom recipes
• Interface - SMEMA, SECS/GEM, OPC-UA, or Modbus TCP
• Safety - explosion-proof configuration for flammable solvents

• Independent station monitoring - each station tracks film thickness trend and alarm history
• Active lid interlock - prevents operation when bowl cover is open
• Solvent drip catcher - reduces maintenance frequency
• Fast recipe download - < 1 sec to change all 24 stations
• Data logging - CSV export per station (spin speed vs. time)
• Low vibration design - < 0.5 µm/s² at maximum speed
• Energy-saving mode - exhaust speed automatically reduced when idle

• Remote installation guidance - video call setup included
• 24/7 technical support - engineering team on call (English/Chinese)
• On-site training - optional (3 days)
• 12-month warranty - extendable to 36 months
• Spare parts availability - 5 years guaranteed
• Process development support - free recipe optimization for your material

A: Yes, each station runs independently. For example, station 1-6 can coat 4-inch wafers, while station 7-12 coat 6-inch wafers -- fully customizable.

A: Yes. We provide customizable slow-dispense and high-torque spin motors (up to 1.5 N*m) for thick photoresist or polyimide.

A: With the optional customizable quick-clean bowl design, changeover < 10 minutes per station. Central chemical lines can be flushed automatically.